In order to achieve high frequency and high density, the functional modules and sub-boards are advancing the process of adopting the bottom plate with built-in components. Manufacturers of digital cameras and personal AV products like "iPod" are actively promoting the use of functional modules to achieve communication functions. In addition, in terms of products such as digital cameras, in addition to communication functions, digital tuners are also moving toward modularization of functions.
In component built-in backplanes, the type that is currently equipped with packaged LSI and chip-type passive components is increasing. For example, the mass-production supply volume of the component built-in substrate manufacturer Da Nippon Printing (DNP) reached a total of 100 million in November 2008 (Figure). The types of bare chips and built-in backplanes in which passive components are embedded in the backplane formation process are currently low in yield, so the cost is too high, and most do not meet the requirements of assembly manufacturers.
(Figure: DNP thins the built-in bottom plate of the component "B2it")
In order to achieve thinness, three methods are used in combination, which are asymmetry between the top and bottom of the layer structure, thinning of the interlayer insulating film, and flattening of built-in components. The picture is made by "Nikkei Micro Devices" based on data from Dainippon Printing (DNP).
The future goal is to achieve the high density required by assembly manufacturers. For example, in the field of mobile phones, in order to reduce RF (Radio Frequency) modules to about 10mm square, assemblers require a fine pitch of 20μm and a thickness of 0.2mm. In order to achieve this goal, first of all, we will advance the component built-in substrate equipped with packaged LSI and chip-type components to a fine pitch and thin type. After that, when this type of base plate reaches a stage where it is difficult to increase the density, there may be a transition to a built-in base plate equipped with bare chips and embedded passive components. At present, Matsushita Electronic Components and DNP (DNP), etc., manufacturers of built-in substrates, are advancing technology development in this direction with the goal of high density
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