As the number of layers increases, mold makers face many challenges. Battenfeldgrowth Engineering's nine-layer OptiflowTM LP (Low Modulus) die uses the same design concept as its 5- and 7-layer OptiflowTM die — making polymer residence time as short as possible. Shorter runners do not create interfacial instability when combining layers of melt. The improved spiral flow path design and sealing technology avoids layer-to-layer contamination, and the modified spiral length increases processing flexibility.
Although the number of layers has increased, innovative co-centric mandrels have remained at the same low die height, which is 50% lower than traditional laminated die heads, making the die easier to use and Installation, operation and maintenance are more efficient. All die parts are machined from the most advanced spacecraft grade, forged, thoroughly hardened and monthly-uniform stress-relieved alloy steels to prevent deformation during cold and hot cycles and under pressure. Excellent dimensional stability gives exceptionally uniform flow rates and excellent film thickness control. Tapered, self-aligning die heads can be quickly and easily installed and removed at the customer's factory to maximize production run time. As a standard, all runner surfaces are electroless nickel-plated to prevent wear and corrosion; other coatings are also available as an option.
Information Source: Plastic Packaging
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